| Manufacturer | Type | Equipment |
| ESEC | 2008 D168 | Die bonder |
| ESEC | 3088 W133 | Wire bonder, fully automatic |
| FICO | Briljant/100 | Molding system’s (1 never used) |
| FICO | TFX-3, TFM | Trim and Form systems |
| Siemens | SP120 | SMD Speed Placer, with feeders |
| Siemens | HS180 HR | SMD placement machine, with feeders |
| Universal | 6241B | Axial sequencer/inserter, in excellent condition, 120
stations, 20 heads wth refire, serviced with JII
Controller, BEC calibration plate, BEC, adjustable
workboard holder |
| Universal | 6348A | Radial inserter, 2.5, 5.0 mm pitch, 40 station
sequencer |
| Universal | 6369E, triple span | Radial inserter, RAD V, in line, 2.5/5.0/7.5 mm
pitch, 20 stations |
| Universal | GSM I | SMT placement machine with feeders and RAMTIF |
| Universal | GSM II | SMT placement machine with feeders and PTF |
| Zevatech | 730 | SMD placement machine |
| Zevatech | PM-460 | SMD placement machine, latest German & English
software, QFP’s, 0.6 mm pitch, with feeders, trayholders
and beamsensor |
| Zevatech | for 460, 560, 570 and 575 | feeders, all size’s |
