| Manufacturer | Type | Equipment |
| Contact | 3AV-100 | SMT placement machine, with two independent placement
heads (2 spindles per head) |
| Contact | 3S-100 | SMT placement machine, pls ask spec’s |
| Dek | 248 | Screenprinter, with vision, fully serviced |
| Dek | 249 | Screenprinter, 431 x 431 mm, non-vision system, fully
serviced |
| Dek | 260 | Screenprinter, 508 x 508 mm, with DekAlign 2 Vision,
fully serviced |
| Disco | DAD 320 | Dicing saw |
| Disco | DAD 341 | Dicing saw |
| Esec | 2006 HR | Die bonder |
| Esec | 3006 F/X | Wire bonder, goldball |
| Esec | 3088 | Wire bonder, goldball |
| Genrad | TS128L | Test system plse ask detailed specifications |
| Genrad | PILOT | Flying probe tester, with active probe circuitry for 4
mobile test heads, Pentium PC with Windows NT, 6 boards support,
Citizen 40 columns printer |
| Genrad | GR228X series | Combo I and Combo II boards for testers |
| HP | 83000F330i | Pinboards |
| Karl Suss | MA-150 | Mask aligner, casette load, max. substrate size 6″ |
| Miki | PCB racks | L x W x H 355 x 320 x 563 mm |
| MPM | AP HiE | Screenprinter with 2D-vision, software 7.13 |
| Philips | Orion | SMT placement machine, with feeders |
| Philips | Topaz | SMT placement machine, with feeders |
| Soltec | Quantis II | Wave soldering machine, left-to-right |
| Tel | P8XL | Wafer prober, with WAPP (wide area probe polisher), hot
chuck |
| Teradyne | for Z1800 | DR1 and DR2 |
| Universal | GS 4713 D | Glue dispenser, in line, 15000 dots per hour |
| Westech | 372 M | CMP polisher, for 8″ |
