| Manufacturer | Type | Equipment |
| BTU | VIP 98 | Reflow oven, width adjust front rail fixed |
| DEK | 260 | screenprinter with vision, with DEKalign 4, wet & dry cleaning |
| ESEC | 3088 | Wire bonders plse ask spec’s |
| Genrad | 2284i | Test system, with 10 Combo II boards (1280 pins) |
| Juki / Zevatech | 560 | SMT placement machine, with feeders |
| MPM | UP3000 | Screenprinter, with autosupport pin system, 2D solder paste height measuring system |
| Mydata | MY-9 | SMT placement machine |
| Okano | BGA-3500 | BGA repair station |
| Panasonic | JV NM-2035 | Jumper wire inserter (LL) with loader and unloader, plse ask spec’s |
| Siemens | Siplace 80 S20 | SMT placement machine with controller, 2×12 fold revolver head etc. |
| Soltec | 6511 Sigma Wave | Wave soldering machine including solder tin with drum fluxer, width 400 mm |
| Fluke | 3051B | Programming station for Fluke 3050 Board Tester |
| Hewlett-Packard | for HP3173 | Hybrid Plus Cards part # E1046-66522 88809L Rev. B 03066-26521 |
| Hewlett-Packard | HP317X Series II | Test system with 2x ASRU “C” , 2x Control Plus Card, 11x Double Density Card, 2x 6624A DUT Power Supply |
| KLA | 2138 | Wafer
defect inspection system, please ask spec’s (still under service contract) |
| Takaya | APT-8400CE | Flying probe tester, please ask spec’s |
| Teradyne | for Spectrum 88XX | CC2 Channel Cards part # 048-830-00 |
| Zevac | DRS 24 | BGA rework system |
